Laurier M9 Series

The low cost small footprint solution for ultra high precision flip chip die bonding.
With the most basic system configuration, the M9 Series will allow you to perform cold compression, thermocompression, adhesive cure, and solder reflow, all without the need for hardware changes.
It is the aim of Datacon to be able to offer not just the technology but also specific solutions for ist customers. A professional team of trainers instructs the customers in both German and English.

Advanced Flip Chip Die Bonder by flip-chip-die-bonder.com